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Varenr.: BX8070110900KF
| Produkt features | |
|---|---|
| Producent | Intel |
| Processor manufacturer | Intel |
| Processor generation | 10th gen Intel® Core™ i9 |
| Processor model | i9-10900KF |
| Processor base frequency | 3.7 GHz |
| Processor family | Intel® Core™ i9 |
| Processor cores | 10 |
| Processor socket | LGA 1200 (Socket H5) |
| Component for | PC |
| Processor lithography | 14 nm |
| Processor threads | 20 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 5.3 GHz |
| Processor cache | 20 MB |
| Processor cache type | Smart Cache |
| Thermal Design Power (TDP) | 125 W |
| Box | Y |
| Configurable TDP-down frequency | 3.3 GHz |
| Cooler included | N |
| Configurable TDP-down | 95 W |
| Generation | 10th Generation |
| Memory bandwidth supported by processor (max) | 45.8 GB/s |
| Processor codename | Comet Lake |
| Processor ARK ID | 199331 |
| Maximum internal memory supported by processor | 128 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Dual-channel |
| ECC | N |
| On-board graphics card | N |
| Discrete graphics card | N |
| On-board graphics card model | Not available |
| Discrete graphics card model | Not available |
| Execute Disable Bit | Y |
| Idle States | Y |
| Thermal Monitoring Technologies | Y |
| Market segment | Desktop |
| Maximum number of PCI Express lanes | 16 |
| PCI Express slots version | 3.0 |
| PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
| Scalability | 1S |
| CPU configuration (max) | 1 |
| Embedded options available | N |
| Thermal solution specification | PCG 2015D |
| PCI Express CEM revision | 3.0 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Y |
| Intel® Identity Protection Technology (Intel® IPT) | Y |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® AES New Instructions (Intel® AES-NI) | Y |
| Enhanced Intel SpeedStep Technology | Y |
| Intel Trusted Execution Technology | N |
| Intel® Thermal Velocity Boost | Y |
| Intel® Turbo Boost Max Technology 3.0 frequency | 5.2 GHz |
| Intel® Turbo Boost Technology 2.0 frequency | 5.1 GHz |
| Intel® Transactional Synchronization Extensions | N |
| Intel® Thermal Velocity Boost Temperature | 70 °C |
| Intel® Thermal Velocity Boost Frequency | 5.3 GHz |
| Intel VT-x with Extended Page Tables (EPT) | Y |
| Intel® Secure Key | Y |
| Intel Stable Image Platform Program (SIPP) | N |
| Intel® OS Guard | Y |
| Intel Software Guard Extensions (Intel SGX) | Y |
| Intel 64 | Y |
| Intel Virtualization Technology (VT-x) | Y |
| Intel Virtualization Technology for Directed I/O (VT-d) | Y |
| Intel Turbo Boost Max Technology 3.0 | Y |
| Intel® Optane™ Memory Ready | Y |
| Intel® Boot Guard | Y |
| Intel® vPro™ Platform Eligibility | N |
| Tjunction | 100 °C |
| Target market | Gaming, Content Creation |
| Launch date | Q2'20 |
| Product type | Processor |
| Status | Launched |
| Maximum memory | 128 GB |
| Supported memory types | DDR4-SDRAM |
| Bus speed | 8 GT/s |
| Harmonized System (HS) code | 85423119 |
| Package type | Retail box |
| Processor package size | 37.5 x 37.5 mm |
| Maximum internal memory | 128 GB |
